The event and its organization
According to a report by IT之家 on 1 November 2026, the 24th edition of the Annual Semiconductor Packaging and Testing Technology and Market Conference will be held from 4 to 6 November 2026 at the Nanjing Fengda International Hotel in China. The event is organized under the supervision of the China Semiconductor Industry Association and with promotion by its section dedicated to packaging and testing.
According to the same source, the organizational structure includes Tianshui Huatian Technology as executive organizer together with Future Semiconductor. The co-organizers listed are Jiangsu Changjiang Electronics Technology, Tongfu Microelectronics and Zhongke Microelectronics Integrated Circuit. The conference will feature a format consisting of a plenary session, thematic presentations and supply-demand matchmaking meetings.
Themes and announced participants
The theme chosen for the 2026 edition is, according to IT之家, “AI opens a new path; packaging and testing forge the foundation of chips.” The format chosen by the organizers aims to bring packaging and testing companies together with those in chip design, glass substrates and TGV technologies, an acronym that in the supply chain refers to through-glass vias.
The source cites as expected speakers representatives of Huatian Technology, Changjiang Electronics Technology, Tongfu Microelectronics, Bilibili Technology, BOE and Yuntian Semiconductor. The attendance list released through the conference’s public channel, as reported by IT之家, also includes Huawei, Xiaomi Auto, Longxin Zhongke, Ziguang Zhanrui, Moore Threads, Cambricon, ByteDance, Yangtze Memory, Hygon, ZTE and Alibaba, as well as universities such as Nanjing University, Tsinghua University, Peking University and Southeast University. The announced size of the event is about 2,000 participants.
Why it matters and what remains to be verified
According to the available data, the significance of the event stems from bringing together in a single forum actors that occupy different positions in the semiconductor supply chain: those that assemble and test chips, those that design them, and those that supply materials and substrates. The announced format, with supply-demand matchmaking meetings, suggests an intention to foster business contacts in addition to technical discussion.
However, the actual weight of these attendances remains to be clarified: the source does not specify which companies will participate with speakers and which will simply be present, nor does it indicate the detailed agenda or the topics of individual presentations. The list of organizations cited should therefore be read as a list of announced participants, not as confirmation of presentations. It is also not disclosed whether the event will be open to the public or reserved for accredited operators. In the absence of this information, the conference’s concrete impact on industrial decisions remains to be verified in the days following the event.
